1366 Technologies announced plans to build a commercial solar wafer manufacturing facility in Genesee County New York that will eventually scale to 3 GW, house 400 Direct Wafer™ furnaces, and produce more than 600 million silicon wafers per year. The initial phase of construction will be a 250MW facility and the company aims to ramp up to 1GW of production capacity as soon as possible. The construction is expected to be completed in 2017.
With the new plan, 1366 Technologies will become the anchor tenant at the high-tech Science and Technology Advanced Manufacturing Park (STAMP) where the company will eventually create more than 1,000 new, full-time jobs in New York’s Finger Lakes Region. The site selection, which will be strategically located between Buffalo and Rochester, marks the start of a phased program to methodically scale 1366 Technologies Direct Wafer™ technology – a transformative manufacturing process that produces a uniformly better silicon solar wafer at half the cost – from 250 MW to 3 GW.
“The facility in Bedford, Massachusetts was our proving ground. New York brings us to commercial scale. The technology is ready and 1366 is squarely positioned to lead in an industry undergoing rapid global growth,” said Frank van Mierlo, CEO, 1366 Technologies.
To encourage 1366 Technologies to invest and establish operations in New York, Governor Cuomo’s administration offered a competitive and attractive incentive package through various state and local resources including Empire State Development, New York’s chief economic development agency; New York State Energy Research and Development Authority (NYSERDA); New York State Homes and Community Renewal (HCR); New York Power Authority (NYPA); and Genesee County Industrial Development Agency. In September 2011, 1366 was also issued a $150 million loan guarantee from the U.S. Department of Energy (DOE) to build a commercial-scale manufacturing facility.
