Automobile sales in China are booming, with a 13 percent year-over-year gain for April 2013, according to the China Association of Automobile Manufacturers. At the same time, the amount of electronic content per vehicle continues to increase as automakers add features to differentiate themselves in this highly competitive market. To help address the need for cost-effective vehicle electronic systems, the Freescale Semiconductor S12 MagniV mixed-signal microcontroller (MCU) portfolio offers Chinese automakers highly integrated, single-chip solutions that are extremely reliable and easy to develop with, while helping reduce the bill of materials and overall manufacturing costs.
“The S12 MagniV single-die solution helps us achieve functionality that previously required multiple devices,” said Jin Zhefeng, senior manager of the Shanghai Automotive Industry Corporation (SAIC) Technology Center. “It also helps us achieve higher reliability while saving board space, reducing the bill of materials and greatly improving compatibility across devices.”
Traditionally, automotive electronic system designs have required multiple components – some created with a high-voltage process to connect to the battery and power actuator outputs, as well as MCUs created with a low-voltage digital logic process. This poses a challenge when the end application has space limitations. S12 MagniV MCUs address this challenge by integrating an analog front end and MCU, providing a comprehensive single-chip solution for applications such as anti-pinch window lifts, instrument clusters and brushless DC motors.
By combining the latest CAN- and LIN-based S12 MagniV devices with the latest Qorivva MCU body control module in a networked system, car OEMs are able to eliminate up to 20 pounds of copper wiring and board components, reducing vehicle weight and further improving fuel economy.
“By incorporating Freescale S12 MagniV mixed-signal MCUs into the development of STEC’s second-generation anti-pinch window lift modules, we were able to save costs, reduce board size and shorten time to market,” said Mo Yongcong, executive director of the Shanghai SIIC Transportation Electric Co., Ltd. (STEC) Research and Development Center. “The S12 MagniV device exceeds traditional multi-component solutions and enables us to lead the way in this fiercely competitive market.”
Through several joint technology labs in China, Freescale is helping accelerate the introduction of innovative designs into the automotive market. Freescale and Tongji University in Shanghai developed an anti-pinch window lift reference design, which demonstrates the capabilities of the S12 MagniV portfolio. This reference design is based on the S12 MagniV S12VR MCU and is ideal for the development of power windows and sun roof systems.
In addition to collaborating with Tongji University, Freescale participates in automotive joint labs across China with partners includingChangAn Motor, Chery, Foton Motor, Dongfeng Motor and FAW. Freescale helps advance the Chinese automotive electronics market through these relationships and also by offering a number of technical design seminars across the country aimed at providing the content and insight needed to help attendees increase productivity and inspire new designs.
