Dongwei Technology announced on January 30 that it has entered into a strategic cooperation agreement with two subsidiaries of SPIC. Under the agreement, they will jointly develop a processing solution for placing copper-plated busbars onto HJT cells. ...  more
Dongwei Technology Expands into Field of HJT Cells by Signing Strategic Cooperation Agreement with SPIC |
published: 2023-02-17 9:30 |